Thermally-enhanced ball grid array package structure and method
View Patent ↗A thermally-enhanced ball grid array package structure is provided that includes an integrated circuit chip, a heat spreader and a substrate. The integrated circuit chip has a specified surface area. The heat spreader is coupled to the integrated circuit chip. The substrate is coupled to the heat spreader. The substrate has a specified surface area. The heat spreader covers a specified portion of the surface area of the substrate that is greater than the surface area of the integrated circuit chip. The heat spreader is operable to dissipate heat from the integrated circuit chip over the specified portion of the surface area of the substrate.
1. A thermally-enhanced ball grid array package structure, comprising:
an integrated circuit chip having a specified surface area;
a heat spreader coupled to the integrated circuit chip; and
a substrate coupled to the heat spreader, the substrate having a specified surface area, the heat spreader covering a specified portion of the surface area of the substrate that is greater than the surface area of the integrated circuit chip, the heat spreader operable to evenly distribute heat from the integrated circuit chip over the specified portion of the surface area of the substrate, the heat spreader comprising a plurality of openings;
a pre-formed adhesive layer adhering at least a portion of a first surface of the heat spreader to a plurality of bonding fingers, and adhering at least a portion of a second surface of the heat spreader to a surface of the substrate underlying the plurality of bonding fingers, the adhesive layer including a plurality of openings aligned with the openings through the heat spreader, the plurality of bonding fingers each having a corresponding bonding wire, the bonding fingers and bonding wires operable to couple the integrated circuit chip to the substrate through the openings in the heat spreader and adhesive layer;
an encapsulation operable to encapsulate at least a portion of the integrated circuit chip, the heat spreader, the bonding wires, and the bonding fingers; and
a plurality of metal balls coupled to the substrate, the metal balls operable to couple the integrated circuit chip to a printed circuit board, the metal balls further operable to distribute heat from the substrate to the printed circuit board.
2. The structure of claim 1 , the heat spreader comprising copper.
3. The structure of claim 1 , wherein the adhesive layer has a shape substantially identical to the heat spreader.
4. The structure of claim 3 , the adhesive layer comprising pre-preg.
5. The thermally-enhanced ball grid array package structure according to claim 1 , wherein the heat spreader covers at least 75% of the surface area of the first substrate surface.
6. The structure of claim 1 , wherein the specified portion comprises at least 75% of the surface area of the substrate.
7. A thermally-enhanced ball grid array package structure, comprising:
a substrate having a specified surface area;
a heat spreader coupled to the substrate, the heat spreader covering a specified portion of the surface area of the substrate, the specified portion greater than a surface area of an integrated circuit chip operable to be coupled to the substrate through the heat spreader, the heat spreader operable to evenly distribute heat from the integrated circuit chip over the specified portion of the surface area of the substrate, the heat spreader comprising a plurality of openings;
a pre-formed adhesive layer adhering at least a portion of a first surface of the heat spreader to a plurality of bonding fingers, and adhering at least a portion of a second surface of the heat spreader to a surface of the substrate underlying the plurality of bonding fingers, the adhesive layer including a plurality of openings aligned with the openings through the heat spreader, the plurality of bonding fingers each having a corresponding bonding wire, the bonding fingers and bonding wires operable to couple the integrated circuit chip to the substrate through the openings in the heat spreader and adhesive layer;
an encapsulation comprising one or more insulating materials and operable to encapsulate at least a portion of the integrated circuit chip, the heat spreader, the bonding wires, and the bonding fingers; and
a plurality of metal balls coupled to the substrate, the metal balls operable to couple the integrated circuit chip to a printed circuit board, the metal balls further operable to distribute heat from the substrate to the printed circuit board.
8. The structure of claim 7 , the heat spreader comprising copper.
9. The structure of claim 7 , wherein the adhesive layer has a shape substantially identical to the heat spreader.
10. The structure of claim 9 , the adhesive layer comprising pre-preg.
11. The structure of claim 7 , wherein the specified portion comprises at least 75% of the surface area of the substrate.
12. A method for providing a thermally-enhanced ball grid array package structure, comprising:
providing a substrate having a specified surface area;
applying a heat spreader to the substrate with an intervening pre-formed adhesive layer adhering at least a portion of a first surface of the heat spreader to a plurality of bonding fingers and adhering at least a portion of a second surface of the heat spreader to a surface of the substrate underlying the plurality of bonding fingers;
applying an integrated circuit chip to the heat spreader, the integrated circuit chip having a specified surface area, the heat spreader covering a specified portion of the surface area of the substrate, the specified portion greater than the surface area of the integrated circuit chip, the heat spreader operable to evenly distribute heat from the integrated circuit chip over the specified portion of the surface area of the substrate;
coupling the integrated circuit chip to the substrate through a plurality of openings through the heat spreader and adhesive layer using a plurality of bonding wires and the bonding fingers;
encapsulating at least a portion of the integrated circuit chip, the heat spreader, the bonding wires, and the bonding fingers using an encapsulation, the encapsulation comprising one or more insulating materials; and
applying a plurality of metal balls to the substrate, the metal balls operable to couple the integrated circuit chip to a printed circuit board, the metal balls further operable to distribute heat from the substrate to the printed circuit board.
13. The method of claim 12 , the heat spreader comprising copper.
14. The method of claim 12 , wherein the adhesive layer has a shape substantially identical to the heat spreader.
15. The method of claim 14 , the adhesive layer comprising pre-preg.
16. The method of claim 12 , wherein the specified portion comprises at least 75% of the surface area of the substrate.
17. A thermally-enhanced ball grid array package structure, comprising:
an integrated circuit chip coupled to a first surface of an insulating substrate material on which are formed patterned conductive traces;
a heat spreader coupled to the first surface of the insulating substrate material, the heat spreader comprising a plurality of openings and covering a surface area of the first surface of the insulating substrate material greater than a surface area of the integrated circuit chip;
a pre-formed adhesive layer adhering at least a portion of a first surface of the heat spreader to at least portions of the patterned conductive traces and adhering at least a portion of a second surface of the heat spreader to the first surface of the insulating substrate material, the adhesive layer including a plurality of openings aligned with the openings through the heat spreader; and
a plurality of solder balls on a second surface of the insulating substrate material opposite the first surface, the plurality of solder balls electrically connected through the patterned conductive traces to the integrated circuit die.