IP Library Assignment 012566/0940
Patent Assignment
Reel/Frame 012566/0940

Assignment of Assignor's Interest

Recorded: 2002-02-05 Pages: 2
Assignor
KAWANO, HIROYUKI
Executed: 2002-01-10
Assignee
OKI ELECTRIC INDUSTRY CO., LTD.
7-12, TORANOMON 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property (1)
Method of Manufacturing a Semiconductor Device Including Etching of a Peripheral Area Before Chemical-Mechanical Polishing
Patent: 6,759,345 →
Application: 10/062,505 →
Publication: US 2002/0127870
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Dec 4, 2008
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 022043/0739 →
Change of Name Mar 21, 2014
From: OKI SEMICONDUCTOR CO., LTD
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 032495/0483 →