Patent Assignment
Reel/Frame 012567/0758
Assignment of Assignor's Interest
Recorded: 2002-01-19
Pages: 3
Assignors
LIN, MOU-SHIUNG
Executed: 2002-01-18
LEE, JIN-YUAN
Executed: 2002-01-18
HUANG, CHING-CHENG
Executed: 2002-01-18
Assignee
MEGIC CORP.
SCIENCE-BASED INDUSTRIAL PARK, 21 R&D FIRST ROAD, HSIN-CHU, TAIWAN
Covered Property
(1)
Thin Film Semiconductor Package Utilizing a Glass Substrate with Comosite Polymer/Metal Interconnect Layers
Patent:
6,673,698 →
Application:
10/054,001 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 4, 2006
From: MEGIC CORPORATION
To: MEGICA CORPORATION
Reel/Frame 017564/0653 →
Merger
Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest
Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →