Patent Assignment
Reel/Frame 012663/0427
Assignment of Assignor's Interest
Recorded: 2002-02-25
Pages: 4
Assignee
TERADYNE, INC.
321 HARRISON AVENUE, BOSTON, MASSACHUSETTS, 02118
Covered Property
(1)
Connector Molding Method and Shielded Waferized Connector Made Therefrom
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.