IP Library Assignment 012681/0424
Patent Assignment
Reel/Frame 012681/0424

Assignment of Assignor's Interest

Recorded: 2002-03-04 Pages: 4
Assignor
HONEYWELL INTERNATIONAL INC.
Executed: 2002-02-11
Assignee
HONEYWELL ADVANCED CIRCUITS, INC.
PO BOX 2245, 101 COLUMBIA ROAD, MORRISTOWN, NEW JERSEY, 07962
Covered Property (1)
Printed Wiring Board with High Density Inner Layer Structure
Patent: 6,586,687 →
Application: 09/951,303 →
Publication: US 2003/0047355
Related Assignments (6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 9, 2001
From: LEE, BRUCE W.; SWOBODA, DAVID G.
To: HONEYWELL INTERNATIONAL INC.
Reel/Frame 012250/0030 →
Change of Name May 20, 2003
From: HONEYWELL ADVANCED CIRCUITS, INC.
To: TTM ADVANCED CIRCUITS, INC.
Reel/Frame 014105/0435 →
Notice of Grant of Security Interest Sep 14, 2005
From: TTM ADVANCED CIRCUITS, INC.
To: WACHOVIA BANK, NATIONAL ASSOCIATION, AS ADMINISTRATIVE AGENT
Reel/Frame 016522/0813 →
Termination of Security Interest in Patents (Releases R/F: 016552/0813) Oct 27, 2006
From: WACHOVIA BANK, NATIONAL ASSOCIATION
To: TTM ADVANCED CIRCUITS, INC.
Reel/Frame 018442/0589 →
Patent Security Agreement Oct 27, 2006
From: TTM ADVANCED CIRCUITS, INC.
To: UBS AG, STAMFORD BRANCH
Reel/Frame 018442/0594 →
Release of Security Agreement Jul 21, 2008
From: UBS AG, STAMFORD BRANCH
To: TTM ADVANCED CIRCUITS, INC.
Reel/Frame 021266/0276 →