IP Library Assignment 012696/0047
Patent Assignment
Reel/Frame 012696/0047

Assignment of Assignor's Interest

Recorded: 2002-03-12 Pages: 2
Assignor
TOMETSUKA, KOUJI
Executed: 2002-03-05
Assignee
HITACHI KOKUSAI ELECTRIC INC.
14-20, 3-CHOME, HIGASHI-NAKANO, NAKANO-KU, TOKYO 164-8511, JAPAN
Covered Property (1)
Substrate Processing Apparatus and Method for Manufacturing Semiconductor Device
Patent: 6,482,753 →
Application: 10/095,072 →
Publication: US 2002/0168854
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 31, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 048008/0206 →