Patent Assignment
Reel/Frame 012714/0962
Assignment of Assignor's Interest
Recorded: 2002-03-15
Pages: 2
Assignee
KONINKLIJKE PHILIPS ELECTRONICS N.V.
GROENEWOUDSEWEG 1, NL-5621 BA EINDHOVEN, NETHERLANDS
Covered Property
(1)
Chip Module with Bond-Wire Connections with Small Loop Height
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 15, 2006
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: NXP B.V.
Reel/Frame 018635/0787 →
Assignment of Assignor's Interest
Mar 17, 2011
From: NXP SEMICONDUCTORS N.V., ON BEHALF OF ITSELF AND ITS SUBSIDIARIES, INCLUDING NXP B.V.
To: TESSERA INTELLECTUAL PROPERTIES, INC.
Reel/Frame 025995/0752 →
Change of Name
Jun 8, 2011
From: TESSERA INTELLECTUAL PROPERTIES, INC.
To: INVENSAS CORPORATION
Reel/Frame 026423/0286 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →