Patent Assignment
Reel/Frame 025995/0752
Assignment of Assignor's Interest
Recorded: 2011-03-17
Pages: 5
Assignor
Assignee
TESSERA INTELLECTUAL PROPERTIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties
(7)
Leadframe Having One or More Power/Ground Planes Without Vias
Patent:
5,386,141 →
Application:
07/860,810 →
Chip on Board Package with Top and Bottom Terminals
Patent:
5,731,227 →
Application:
08/768,966 →
Face on Face Flip Clip Integration
Patent:
6,057,598 →
Application:
08/794,272 →
Chip Module with Bond-Wire Connections with Small Loop Height
Quad Flat Non-Leaded Package Comprising a Semiconductor Device
Electronic Device and Method of Manufacturing Thereof
Electronic Device and Method of Manufacturing Thereof
Related Assignments
(25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignors Interest.
Mar 31, 1992
From: LIANG, LOUIS H.; CHOW WANG, TSING
To: VLSI TECHNOLOGY, INC.
Reel/Frame 006076/0170 →
Assignment of Assignor's Interest
May 19, 1997
From: PAYNE, ROBERT L.; REITER, HERBERT
To: VLSI TECHNOLOGY, INC.
Reel/Frame 008526/0573 →
Assignment of Assignor's Interest
Mar 15, 2002
From: SCHOBER, JOACHIM; TOTH, MARCUS
To: KONINKLIJKE PHILIPS ELECTRONICS N.V.
Reel/Frame 012714/0962 →
Assignment of Assignor's Interest
Dec 1, 2004
From: ROHRMOSER, BERND; WEISS, THOMAS
To: KONINKLIJKE PHILIPS ELECTRONICS N.V.
Reel/Frame 016469/0389 →
Assignment of Assignor's Interest
Apr 11, 2006
From: SCHRIKS, CORNELIS GERARDUS; DIJKSTRA, PAUL; VAN DE WATER, PETER WILHELMUS MARIA; GROENHUIS, ROELF ANCO JACOB
To: KONINKLIJKE PHILIPS ELECTRONICS, N.V.
Reel/Frame 017805/0217 →
Change of Name
Dec 15, 2006
From: VLSI TECHNOLOGY, INC.
To: PHILIPS SEMICONDUCTORS VLSI INC.
Reel/Frame 018635/0570 →
Assignment of Assignor's Interest
Dec 15, 2006
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: NXP B.V.
Reel/Frame 018635/0787 →
Assignment of Assignor's Interest
Dec 15, 2006
From: PHILIPS SEMICONDUCTORS INC.
To: NXP B.V.
Reel/Frame 018645/0779 →
Change of Name
Dec 22, 2006
From: PHILIPS SEMICONDUCTORS VLSI INC.
To: PHILIPS SEMICONDUCTORS INC.
Reel/Frame 018668/0255 →
Security Agreement
Jan 22, 2007
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 018806/0201 →
Assignment of Assignor's Interest
Aug 17, 2007
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: NXP B.V.
Reel/Frame 019719/0843 →
Release of Security Interest
Feb 18, 2011
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 025839/0279 →
Change of Name
Jun 8, 2011
From: TESSERA INTELLECTUAL PROPERTIES, INC.
To: INVENSAS CORPORATION
Reel/Frame 026423/0286 →
Assignment of Assignor's Interest
Sep 26, 2011
From: SCHRIKS, CORNELIS GERARDUS; DIJKSTRA, PAUL; VAN DE WATER, PETER WILHELMUS MARIA; GROENHUIS, ROELF ANCO JACOB
To: KONINKLIJKE PHILIPS ELECTRONICS N.V.
Reel/Frame 026997/0305 →
Assignment of Assignor's Interest
Sep 27, 2011
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: NXP B.V.
Reel/Frame 026997/0795 →
Security Agreement Supplement
Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
Corrective Assignment to Correct the Remove Application 12092129 Previously Recorded on Reel 038017 Frame 0058. Assignor(S) Hereby Confirms the Security Agreement Supplement.
Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
Patent Release
Aug 17, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 039707/0471 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Corrective Assignment to Correct the Remove Application 12681366 Previously Recorded on Reel 039361 Frame 0212. Assignor(S) Hereby Confirms the Security Agreement Supplement.
May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
Corrective Assignment to Correct the Remove Application 12681366 Previously Recorded on Reel 038017 Frame 0058. Assignor(S) Hereby Confirms the Security Agreement Supplement.
May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
Release of Security Interest
Sep 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC
To: NXP B.V.
Reel/Frame 050315/0443 →
Release of Security Interest
Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
Corrective Assignment to Correct the Remove Application 12298143 Previously Recorded on Reel 039361 Frame 0212. Assignor(S) Hereby Confirms the Security Agreement Supplement.
Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
Corrective Assignment to Correct the Remove Application 12298143 Previously Recorded on Reel 042985 Frame 0001. Assignor(S) Hereby Confirms the Security Agreement Supplement.
Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →