Patent Assignment
Reel/Frame 025839/0279
Release of Security Interest
Recorded: 2011-02-18
Pages: 10
Assignor
MORGAN STANLEY SENIOR FUNDING, INC.
Executed: 2011-01-27
Assignee
NXP B.V.
HIGH TECH CAMPUS 60, EINDHOVEN, 5656 AG, NETHERLANDS
Covered Property
(1)
Face on Face Flip Clip Integration
Patent:
6,057,598 →
Application:
08/794,272 →
Related Assignments
(10)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
May 19, 1997
From: PAYNE, ROBERT L.; REITER, HERBERT
To: VLSI TECHNOLOGY, INC.
Reel/Frame 008526/0573 →
Change of Name
Dec 15, 2006
From: VLSI TECHNOLOGY, INC.
To: PHILIPS SEMICONDUCTORS VLSI INC.
Reel/Frame 018635/0570 →
Assignment of Assignor's Interest
Dec 15, 2006
From: PHILIPS SEMICONDUCTORS INC.
To: NXP B.V.
Reel/Frame 018645/0779 →
Change of Name
Dec 22, 2006
From: PHILIPS SEMICONDUCTORS VLSI INC.
To: PHILIPS SEMICONDUCTORS INC.
Reel/Frame 018668/0255 →
Security Agreement
Jan 22, 2007
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 018806/0201 →
Assignment of Assignor's Interest
Mar 17, 2011
From: NXP SEMICONDUCTORS N.V., ON BEHALF OF ITSELF AND ITS SUBSIDIARIES, INCLUDING NXP B.V.
To: TESSERA INTELLECTUAL PROPERTIES, INC.
Reel/Frame 025995/0752 →
Change of Name
Jun 8, 2011
From: TESSERA INTELLECTUAL PROPERTIES, INC.
To: INVENSAS CORPORATION
Reel/Frame 026423/0286 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Release of Security Interest
Sep 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC
To: NXP B.V.
Reel/Frame 050315/0443 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →