IP Library › Granted Patent US 6,593,664
Granted Patent Utility
US 6,593,664 · Confirmation No. 4931

CHIP MODULE WITH BOND-WIRE CONNECTIONS WITH SMALL LOOP HEIGHT

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2020-06-11 OATH Oath or Declaration filed 262 View
2011-04-20 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2011-04-20 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2011-04-11 PA.. Power of Attorney 1 View
2011-04-11 R3.73 Assignee showing of ownership per 37 CFR 3.73 1 View
2011-04-11 N417 Electronic Filing System Acknowledgment Receipt 2 View
2002-03-15 TRNA Transmittal of New Application 1 View
2002-03-15 SPEC Specification 5 View
2002-03-15 CLM Claims 2 View
2002-03-15 ABST Abstract 1 View
2002-03-15 DRW Drawings-only black and white line drawings 1 View
2002-03-15 OATH Oath or Declaration filed 2 View
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Quick Facts
Patent No.
US 6,593,664
App. No.
10/099,682
Filed
2002-03-15
Granted
2003-07-15
Pub. No.
US20020135078A1
Art Unit
2815
PTA
-5 days