Patent Assignment
Reel/Frame 012905/0974
Assignment of Assignor's Interest
Recorded: 2002-05-10
Pages: 2
Assignors
SONG, YOUNG HEE
Executed: 2002-04-04
SON, MIN YOUNG
Executed: 2002-04-04
HA, WOONG KY
Executed: 2002-04-04
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, PALDAL-KU, SUWON-CITY, KYUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Wafer Level Package Having a Side Package