Wafer level package having a side package
A method of manufacturing a wafer level package includes forming a semiconductor wafer including semiconductor chips, and forming a package body on the sides of each semiconductor chip. The package body is formed by forming a space between each semiconductor chip and potting a package material in the space, which can be a mold resin. The wafer is then separated into separate semiconductor chips by cutting through the package body.
1. A method of manufacturing a wafer level package comprising:
forming a semiconductor wafer, wherein the semiconductor wafer includes a plurality of semiconductor chips, wherein each semiconductor chip of the plurality of semiconductor chips includes a plurality of electrode pads;
creating a gap between each said semiconductor chip of the plurality of semiconductor chips such that each said semiconductor chip is separate from each other;
providing a package material only to each said gap to form a package body on vertical sides of each semiconductor chip of the plurality of semiconductor chips.
2. The method of claim 1 , wherein forming the wafer further comprises:
forming a first insulating layer on the semiconductor wafer; and
exposing the plurality of electrode pads.
3. The method of claim 2 , wherein forming the first insulating layer on the semiconductor wafer comprises:
forming a passivation layer on the semiconductor wafer; and
forming the first insulating layer on the passivation layer.
4. The method of claim 2 , wherein forming the wafer further comprises:
forming a metal wiring layer on the first insulating layer, wherein the metal wiring layer is electrically connected to the electrode pads.
5. The method of claim 4 , wherein forming the wafer further comprises:
forming a second insulating layer on the metal wiring layer; and
providing openings in the metal wiring layer.
6. The method of claim 5 , wherein forming the wafer further comprises:
forming an electrical connection on the metal wiring layer through the opening.
7. The method of claim 1 , wherein the package material is a molded resin.
8. The method of claim 2 , further comprising: separating the wafer into a plurality of separate semiconductor chips.
9. The method of claim 8 , wherein separating the wafer comprises:
cutting the package body.
10. The method of claim 9 , wherein cutting the package body comprises:
cutting the package body with a rotating cutting blade.
11. The method of claim 1 , further comprising attaching a tape to a bottom surface of each said semiconductor chip.
12. The method of claim 11 , wherein the tape is an expandable tape.
13. The method of claim 1 , wherein the wafer level package includes
a semiconductor chip from the plurality of semiconductor chips, wherein the plurality of electrode pads are positioned on an active surface of the semiconductor chip; and
the package body formed on the sides of the semiconductor chip.