IP Library Assignment 012915/0160
Patent Assignment
Reel/Frame 012915/0160

Assignment of Assignor's Interest

Recorded: 2002-05-17 Pages: 3
Assignors
MIHARA, TAKAYUKI
Executed: 2002-04-23
AKASAKI, YUJI
Executed: 2002-04-23
Assignee
FUJITSU LIMITED
1-1 KAMIKODANAKA 4-CHOME, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA 211-8588, JAPAN
Covered Property (1)
Semiconductor Device Having a Signal Lead Exposed on the Undersurface of a Sealing Resin with an Air Gap Between the Signal Lead and a Mounting Substrate
Patent: 6,781,223 →
Application: 10/146,904 →
Publication: US 2003/0102550
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 9, 2008
From: FUJITSU LIMITED
To: FUJITSU MICROELECTRONICS LIMITED
Reel/Frame 021976/0089 →
Change of Name Jul 9, 2010
From: FUJITSU MICROELECTRONICS LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 024651/0744 →