Patent Assignment
Reel/Frame 012922/0171
Assignment of Assignor's Interest
Recorded: 2002-05-20
Pages: 3
Assignor
KENT, OSMAN
Executed: 2002-04-19
Assignee
REID HALL
3DLABS INC., LTD., HAMILTON HM11,, BERMUDA
Covered Property
(1)
Yield Enhancement of Complex Chips
Related Assignments
(9)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 10, 2014
From: 3DLABS INC., LTD.
To: ZIILABS INC., LTD.
Reel/Frame 032423/0468 →
Assignment of Assignor's Interest
Apr 19, 2019
From: ZIILABS INC., LTD
To: RPX CORPORATION
Reel/Frame 048947/0592 →
Assignment of Assignor's Interest
Aug 5, 2020
From: RPX CORPORATION
To: MEDIATEK INC.
Reel/Frame 054107/0830 →
Release of Lien on Patents
Aug 14, 2020
From: JEFFERIES FINANCE LLC, AS COLLATERAL AGENT
To: RPX CORPORATION
Reel/Frame 053498/0067 →
Assignment of Assignor's Interest
Aug 21, 2020
From: RPX CORPORATION
To: MEDIATEK INC.
Reel/Frame 054152/0888 →
Patent Security Agreement
Oct 23, 2020
From: RPX CLEARINGHOUSE LLC; RPX CORPORATION
To: BARINGS FINANCE LLC, AS COLLATERAL AGENT
Reel/Frame 054244/0566 →
Patent Security Agreement
Oct 23, 2020
From: RPX CLEARINGHOUSE LLC; RPX CORPORATION
To: BARINGS FINANCE LLC, AS COLLATERAL AGENT
Reel/Frame 054198/0029 →
Assignment of Assignor's Interest
Mar 18, 2021
From: MEDIATEK INC.
To: XUESHAN TECHNOLOGIES INC.
Reel/Frame 056593/0167 →
Release of Security Interest in Specified Patents
May 10, 2022
From: BARINGS FINANCE LLC
To: RPX CLEARINGHOUSE LLC
Reel/Frame 059925/0652 →