IP Library › Assignment 012929/0800
Patent Assignment
Reel/Frame 012929/0800

Assignment of Assignor's Interest

Recorded: 2002-05-29 Pages: 8
Assignors
BHAGAVAT, MILIND S.
Executed: 2002-04-22
WITTE, DALE A.
Executed: 2002-04-22
KIMBEL, STEVEN L.
Executed: 2002-05-02
SAGER, DAVID ALAN
Executed: 2002-04-22
PEYTON, JOHN W.
Executed: 2002-04-22
Assignee
MEMC ELECTRONIC MATERIALS, INC.
P.O. BOX 8, 501 PEARL DRIVE, ST. PETERS, MISSOURI, 63376
Covered Property (1)
Method and apparatus for slicing semiconductor wafers
Application: 60/362,379 →
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement Mar 19, 2003
From: MEMC ELECTRONIC MATERIALS, INC.; MEMC PASADENA, INC.; PLASMASIL, L.L.C.; SIBOND, L.L.C.
To: CITICORP USA, INC.
Reel/Frame 013964/0378 →