Patent Application
Provisional
App. No. 60/362,379
· Confirmation No. 8658
Method and apparatus for slicing semiconductor wafers
Provisional Application Expired
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⬇ PDF
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Code | Description | Pages | ||
|---|---|---|---|---|---|
| 2002-03-07 | TRNA |
Transmittal of New Application | 3 | View | |
| 2002-03-07 | ADS |
Application Data Sheet | 3 | View | |
| 2002-03-07 | SPEC |
Specification | 15 | View | |
| 2002-03-07 | CLM |
Claims | 2 | View | |
| 2002-03-07 | ABST |
Abstract | 1 | View | |
| 2002-03-07 | DRW |
Drawings-only black and white line drawings | 12 | View | |
| 2002-03-07 | LET. |
Miscellaneous Incoming Letter | 1 | View |
Inventors
Milind Bhagavat
St. Louis, MO
Dale A. Witte
O'Fallon, MO
Steven L. Kimbel
St. Charles, MO
David Alan Sager
Hazelwood, MO
John Peyton
St. Charles, MO
Attorneys & Agents of Record
Prosecution
- Customer No.
- 321
- Docket No.
- MEMC 01-3000 (3017)
- Confirmation No.
- 8658
from
MEMC ELECTRONIC MATERIALS, INC.,
MEMC PASADENA, INC.,
PLASMASIL, L.L.C.,
MEMC HOLDINGS CORPORATION,
MEMC INTERNATIONAL, INC.,
MEMC SOUTHWEST INC.,
SIBOND, L.L.C.
SECURITY AGREEMENT
Recorded 2003-03-19
ASSIGNMENT OF ASSIGNOR'S INTEREST
Recorded 2002-05-29
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Quick Facts
- App. No.
- 60/362,379
- Filed
- 2002-03-07
External Links