IP Library › Assignment 012930/0706
Patent Assignment
Reel/Frame 012930/0706

Assignment of Assignor's Interest

Recorded: 2002-05-20 Pages: 2
Assignors
WU, CHUNG JU
Executed: 2002-02-28
LIANG, KUEI CHEN
Executed: 2002-02-28
LIN, WEI FENG
Executed: 2002-02-28
Assignee
SILICON INTEGRATED SYSTEMS CORP.
NO. 16, CREATION RD. 1, SCIENCE-BASED PARK, HSINCHU, R.O.C, TAIWAN
Covered Property (1)
Substrate for Semiconductor Package
Patent: 6,933,600 →
Application: 10/152,191 →
Publication: US 2003/0160294
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 4, 2009
From: WU, CHUNG JU; LIANG, KUEI CHEN; LIN, WEI FENG
To: SILICON INTEGRATED SYSTEMS CORP.
Reel/Frame 022634/0116 →
Assignment of Assignor's Interest Oct 8, 2009
From: SILICON INTEGRATED SYSTEMS CORP.
To: TAICHI HOLDINGS, LLC
Reel/Frame 023348/0301 →
Assignment of Assignor's Interest Jan 3, 2020
From: TAICHI HOLDINGS, LLC
To: INTELLECTUAL VENTURES ASSETS 154 LLC
Reel/Frame 051412/0949 →
Assignment of Assignor's Interest Jan 27, 2020
From: INTELLECTUAL VENTURES ASSETS 154 LLC
To: LIBERTY PATENTS LLC
Reel/Frame 051709/0805 →