Patent Assignment
Reel/Frame 012955/0276
Assignment of Assignor's Interest
Recorded: 2002-06-04
Pages: 4
Assignors
FUKUOKA, YOSHITAKA
Executed: 2002-05-29
SERIZAWA, TOORU
Executed: 2002-05-29
YAGI, HIROSHI
Executed: 2002-05-29
SHIMADA, OSAMU
Executed: 2002-05-29
HIRAI, HIROYUKI
Executed: 2002-05-29
YAMAGUCHI, YUJI
Executed: 2002-05-29
Assignees
DAI NIPPON PRINTING CO., LTD.
1-1-1, ICHIGAYA KAGA-CHO, SHINJUKU-KU, TOKYO 162-0062, JAPAN
D.T. CIRCUIT TECHNOLOGY CO., LTD.
2-1, TOSHIBA-CHO, FUCHU-SHI, TOKYO 183-0043, JAPAN
Covered Property
(1)
Wiring Board Provided with Passive Element and Cone Shaped Bumps
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 9, 2002
From: FUKUOKA, YOSHITAKA; SERIZAWA, TOORU; YAGI, HIROSHI; SHIMADA, OSAMU
To: DAI NIPPON PRINTING CO., LTD.; D.T. CIRCUIT TECHNOLOGY CO., LTD.
Reel/Frame 013181/0479 →
Assignment of Assignor's Interest
Dec 15, 2008
From: DNP FINE ELECTRONICS CO., LTD.
To: DAI NIPPON PRINTING CO., LTD.
Reel/Frame 021998/0722 →
Merger
Dec 15, 2008
From: D.T. CIRCUIT TECHNOLOGY CO., LTD
To: DNP FINE ELECTRONICS CO., LTD
Reel/Frame 022012/0733 →