IP Library Assignment 012981/0031
Patent Assignment
Reel/Frame 012981/0031

Assignment of Assignor's Interest

Recorded: 2002-06-04 Pages: 2
Assignors
TOBITA, MASAYUKI
Executed: 2002-05-23
SHIMOYAMA, NAOYUKI
Executed: 2002-05-23
TATEDA, SHINYA
Executed: 2002-05-23
Assignee
POLYMATECH CO., LTD.
CHUO-KU, SENJYO BLDG., 4-8-16, NIHONBASHI-HONCHO, TOKYO 103-8424, JAPAN
Covered Property (1)
Thermally Conductive Molded Article and Method of Making the Same
Patent: 7,264,869 →
Application: 10/162,520 →
Publication: US 2002/0197923
Related Assignments (5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 19, 2017
From: POLYMA ASSET MANAGEMENT CO., LTD
To: POLYMATECH JAPAN CO., LTD.
Reel/Frame 042058/0969 →
Succession Apr 19, 2017
From: POLYMATECH CO., LTD
To: POLMA ASSET MANAGEMENT CO., LTD.
Reel/Frame 042094/0751 →
Succession Apr 19, 2017
From: POLYMATECH CO., LTD
To: PT ESTABLISHMENT PREPARATION CO., LTD
Reel/Frame 042094/0848 →
Change of Name Apr 19, 2017
From: PT ESTABLISHMENT PREPARATION CO., LTD
To: POLYMATECH JAPAN CO., LTD.
Reel/Frame 042094/0934 →
Change of Name May 20, 2019
From: POLYMATECH JAPAN CO., LTD.
To: SEKISUI POLYMATECH CO., LTD.
Reel/Frame 049225/0434 →