Patent Assignment
Reel/Frame 042094/0848
Succession
Recorded: 2017-04-19
Pages: 18
Assignor
POLYMATECH CO., LTD
Executed: 2012-12-28
Assignee
PT ESTABLISHMENT PREPARATION CO., LTD
6-1, HIRAKAWA-CHO 2-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Thermally Conductive Molded Article and Method of Making the Same
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 4, 2002
From: TOBITA, MASAYUKI; SHIMOYAMA, NAOYUKI; TATEDA, SHINYA
To: POLYMATECH CO., LTD.
Reel/Frame 012981/0031 →
Assignment of Assignor's Interest
Apr 19, 2017
From: POLYMA ASSET MANAGEMENT CO., LTD
To: POLYMATECH JAPAN CO., LTD.
Reel/Frame 042058/0969 →
Succession
Apr 19, 2017
From: POLYMATECH CO., LTD
To: POLMA ASSET MANAGEMENT CO., LTD.
Reel/Frame 042094/0751 →
Change of Name
Apr 19, 2017
From: PT ESTABLISHMENT PREPARATION CO., LTD
To: POLYMATECH JAPAN CO., LTD.
Reel/Frame 042094/0934 →
Change of Name
May 20, 2019
From: POLYMATECH JAPAN CO., LTD.
To: SEKISUI POLYMATECH CO., LTD.
Reel/Frame 049225/0434 →