Patent Assignment
Reel/Frame 013046/0487
Assignment of Assignor's Interest
Recorded: 2002-06-21
Pages: 2
Assignors
KOO, KYEONGMO
Executed: 2002-06-10
WON, JAIHYUNG
Executed: 2002-06-10
UM, HYEONILL
Executed: 2002-06-10
JUNG, JUNHYUK
Executed: 2002-06-11
PARK, SANGWOOK
Executed: 2002-06-11
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, PALDAL-GU, SUWON-CITY, KYUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Forming Barrier Layer of Semiconductor Device