Patent Assignment
Reel/Frame 013070/0286
Assignment of Assignor's Interest
Recorded: 2002-06-27
Pages: 2
Assignee
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
YUSONG-GU, 161, GAJEONG-DONG, DAEJON, KOREA, REPUBLIC OF
Covered Property
(1)
Optical Module Package of Flip Chip Bonding
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.