Assignment of Assignor's Interest

Recorded: 2002-07-03 Pages: 2

Assignor

USAMI, TETSUO

Executed: 2002-06-21

Assignee

OKI ELECTRIC INDUSTRY CO., LTD.

7-12, TORANOMON 1-CHOME, MINATO-KU, TOKYO, JAPAN

Covered Property (1)

Method of Forming Multilayered Conductive Layers for Semiconductor Device

Patent: 6,777,328 →

Application: 10/187,840 →

Publication: US 2003/0235977

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.