Patent Assignment
Reel/Frame 013113/0609
Assignment of Assignor's Interest
Recorded: 2002-07-22
Pages: 3
Assignors
SHARMA, LAXMINARAYAN
Executed: 2002-06-12
FAZELPOUR, SIAMAK
Executed: 2002-06-12
YANG, HONG
Executed: 2002-06-12
Assignee
APPLIED MICRO CIRCUITS CORPORATION
6290 SEQUENCE DRIVE, SAN DIEGO, CALIFORNIA, 92121
Covered Property
(1)
Electronic Device Package with High Speed Signal Interconnect Between Die Pad and External Substrate Pad
Patent:
6,566,761 →
Application:
10/138,662 →
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.