IP Library › Granted Patent US 6,566,761
Granted Patent Utility
US 6,566,761 · Confirmation No. 3004

ELECTRONIC DEVICE PACKAGE WITH HIGH SPEED SIGNAL INTERCONNECT BETWEEN DIE PAD AND EXTERNAL SUBSTRATE PAD

Patented Case View Patent ↗
⬇ PDF
 Code Description Pages PDF
2008-12-24 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2008-12-24 N570 Communication - Re: Power of Attorney (PTOL-308) 1 View
2008-12-16 N417 Electronic Filing System Acknowledgment Receipt 2 View
2008-12-16 PA.. Power of Attorney 1 View
2008-12-16 R3.73 Assignee showing of ownership per 37 CFR 3.73 1 View
2002-05-03 TRNA Transmittal of New Application 4 View
2002-05-03 SPEC Specification 13 View
2002-05-03 CLM Claims 5 View
2002-05-03 ABST Abstract 1 View
2002-05-03 DRW Drawings-only black and white line drawings 4 View
2002-05-03 OATH Oath or Declaration filed 2 View
2002-05-03 LET. Miscellaneous Incoming Letter 1 View
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this application's details
Quick Facts
Patent No.
US 6,566,761
App. No.
10/138,662
Filed
2002-05-03
Granted
2003-05-20
Art Unit
2815
PTA
0 days