IP Library › Assignment 013152/0878
Patent Assignment
Reel/Frame 013152/0878

Assignment of Assignor's Interest

Recorded: 2002-08-02 Pages: 2
Assignors
MAA, CHONG-REN
Executed: 2002-05-17
CHIH, WAN-KUO
Executed: 2002-05-17
TSAI, MING-SUNG
Executed: 2002-05-17
SHAN, WEI-HENG
Executed: 2002-05-17
Assignees
UNITED TEST CENTER INC.
NO. 2, LI-HSIN RD. 3, SCIENCE-BASED INDUSTRIAL PARK, HSIN CHU, R.O.C., TAIWAN
S & S TECHNOLOGY CORPORATION
NO. 20, LANE 21, DASHING 1ST ST., DA CHU, TAOYUAN, R.O.C., TAIWAN
Covered Property (1)
Wire-bonded chip on board package
Application: 10/152,770 →
Publication: US 2003/0205793
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Jan 16, 2003
From: S & S TECHNOLOGY CORPORATION
To: ULTRATERA CORPORATION
Reel/Frame 013663/0384 →
Change of Name Jan 16, 2003
From: UNITED TEST CENTER, INC.
To: ULTRATERA CORPORATION
Reel/Frame 013666/0933 →