Patent Assignment
Reel/Frame 013666/0933
Change of Name
Recorded: 2003-01-16
Pages: 4
Assignor
UNITED TEST CENTER, INC.
Executed: 2002-03-19
Assignee
ULTRATERA CORPORATION
NO. 2 LI-HSIN RD. 3, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, R.O.C., TAIWAN
Covered Properties
(2)
Flip chip package
Application:
10/152,616 →
Publication:
US 2003/0201544
Wire-bonded chip on board package
Application:
10/152,770 →
Publication:
US 2003/0205793
Related Assignments
(3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 2, 2002
From: MAA, CHONG-REN; CHIH, WAN-KUO; TSAI, MING-SUNG; SHAN, WEI-HENG
To: UNITED TEST CENTER INC.; S&S TECHNOLOGY CORPORATION
Reel/Frame 013152/0011 →
Assignment of Assignor's Interest
Aug 2, 2002
From: MAA, CHONG-REN; CHIH, WAN-KUO; TSAI, MING-SUNG; SHAN, WEI-HENG
To: UNITED TEST CENTER INC.; S & S TECHNOLOGY CORPORATION
Reel/Frame 013152/0878 →
Merger
Jan 16, 2003
From: S & S TECHNOLOGY CORPORATION
To: ULTRATERA CORPORATION
Reel/Frame 013663/0384 →