Patent Assignment
Reel/Frame 013170/0835
Assignment of Assignor's Interest
Recorded: 2002-08-01
Pages: 2
Assignor
TAKADO, TSUMORU
Executed: 2002-07-31
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Sealing Resin, Resin-Sealed Semiconductor and System-In-Package
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.