IP Library › Assignment 013173/0204
Patent Assignment
Reel/Frame 013173/0204

Assignment of Assignor's Interest

Recorded: 2002-08-06 Pages: 3
Assignors
WU, CHUNG-JU
Executed: 2002-07-11
LIANG, KUEI-CHEN
Executed: 2002-07-11
LIN, WEI-FENG
Executed: 2002-07-11
Assignee
SILICON INTEGRATED SYSTEMS CORP.
NO. 16, CREATION RD. 1, SCIENCE-BASED INDUSTRIAL PARK, HSIN CHU, R.O.C., TAIWAN
Covered Property (1)
Integrated Circuit Bonding Device and Manufacturing Method Thereof
Patent: 6,765,301 →
Application: 10/212,106 →
Publication: US 2003/0094703
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 8, 2009
From: SILICON INTEGRATED SYSTEMS CORP.
To: TAICHI HOLDINGS, LLC
Reel/Frame 023348/0301 →