Patent Assignment
Reel/Frame 013212/0548
Assignment of Assignor's Interest
Recorded: 2002-08-22
Pages: 3
Assignors
SUZUKI, HIROMICHI
Executed: 2002-06-26
KAMEOKA, AKIHIKO
Executed: 2002-06-26
YAMADA, MASAUR
Executed: 2002-06-26
NISHITA, TAKAFUMI
Executed: 2002-06-26
ITO, FUJIO
Executed: 2002-06-26
KUSUKAWA, JUNPEI
Executed: 2002-07-01
TAKEUSHI, RYOZO
Executed: 2002-07-01
ISHII, TOSHIAKI
Executed: 2002-07-01
Assignees
HITACHI, LTD.
6, KANDA SURUGADAI 4-CHOME, CHIYODA-KU, TOKYO, JAPAN
HITACHI ULSI SYSTEMS CO., LTD.
22-1 JOSUIHONCHO 5-CHOME, KODAIRA-SHI, TOKYO, JAPAN
Covered Property
(1)
Semiconductor device employing encapsulation resin having additive reactive with ionic impurities
Application:
10/225,184 →
Publication:
US 2003/0052420
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Spelling of the 3RD and 7TH Assignor Previously Recorded on Reel 013212 Frame 0548. (Assignor Hereby Confrims the Assignment of the Entire Interest)
Dec 13, 2002
From: SUZUKI, HIROMICHI; KAMEOKA, AKIHIKO; YAMADA, MASARU; NISHITA, TAKAFUMI
To: HITACHI, LTD.; HITACHI ULSI SYSTEMS CO., LTD.
Reel/Frame 013573/0851 →
Assignment of Assignor's Interest
Dec 11, 2003
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 014190/0088 →