Patent Assignment
Reel/Frame 013573/0851
Corrective Assignment to Correct the Spelling of the 3RD and 7TH Assignor Previously Recorded on Reel 013212 Frame 0548. (Assignor Hereby Confrims the Assignment of the Entire Interest)
Recorded: 2002-12-13
Pages: 5
Assignors
SUZUKI, HIROMICHI
Executed: 2002-06-26
KAMEOKA, AKIHIKO
Executed: 2002-06-26
YAMADA, MASARU
Executed: 2002-06-26
NISHITA, TAKAFUMI
Executed: 2002-06-26
ITO, FUJIO
Executed: 2002-06-26
KUSUKAWA, JUNPEI
Executed: 2002-07-01
TAKEUCHI, RYOZO
Executed: 2002-07-01
ISHII, TOSHIAKI
Executed: 2002-07-01
Assignees
HITACHI, LTD.
6, KANDA SURUGADAI 4-CHOME CHIYODA-KU, TOKYO, JAPAN
HITACHI ULSI SYSTEMS CO., LTD.
22-1, JOSUIHONCHO 5-CHOME KODAIRA-SHI, TOKYO, JAPAN
Covered Property
(1)
Semiconductor device employing encapsulation resin having additive reactive with ionic impurities
Application:
10/225,184 →
Publication:
US 2003/0052420
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 22, 2002
From: SUZUKI, HIROMICHI; KAMEOKA, AKIHIKO; YAMADA, MASAUR; NISHITA, TAKAFUMI
To: HITACHI, LTD.; HITACHI ULSI SYSTEMS CO., LTD.
Reel/Frame 013212/0548 →
Assignment of Assignor's Interest
Dec 11, 2003
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 014190/0088 →