IP Library Assignment 013237/0017
Patent Assignment
Reel/Frame 013237/0017

Assignment of Assignor's Interest

Recorded: 2002-08-28 Pages: 3
Assignors
OUELLET, LUC
Executed: 2002-06-21
ANTAKI, ROBERT
Executed: 2002-06-21
TREMBLAY, YVES
Executed: 2002-06-21
Assignee
DALSA SEMICONDUCTOR INC.
18 AIRPORT ROAD, BROMONT, QC, J2L 1S7, CANADA
Covered Property (1)
Fabrication of Microstructures with Vacuum-Sealed Cavity
Patent: 6,902,656 →
Application: 10/153,593 →
Publication: US 2003/0217915
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Oct 14, 2011
From: DALSA SEMICONDUCTOR INC.
To: TELEDYNE DALSA SEMICONDUCTOR INC.
Reel/Frame 027064/0622 →
Merger Feb 26, 2021
From: TELEDYNE DALSA SEMICONDUCTOR INC.
To: TELEDYNE DIGITAL IMAGING, INC.
Reel/Frame 055434/0643 →