IP Library › Assignment 013246/0343
Patent Assignment
Reel/Frame 013246/0343

Assignment of Assignor's Interest

Recorded: 2002-11-15 Pages: 3
Assignors
ERIKSON, KENNETH R.
Executed: 2002-10-30
MARCINIEC, JOHN W.
Executed: 2002-10-30
Assignee
Covered Property (1)
High-Density Interconnection of Temperature Sensitive Electronic Devices
Patent: 6,716,669 →
Application: 10/284,999 →
Publication: US 2004/0023433
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 27, 2012
From: BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION, INC.
To: SCHILMASS CO. L.L.C.
Reel/Frame 027608/0445 →
Merger Jan 22, 2016
From: SCHILMASS CO. L.L.C.
To: GULA CONSULTING LIMITED LIABILITY COMPANY
Reel/Frame 037559/0856 →