Assignment of Assignor's Interest

Recorded: 2002-08-30 Pages: 4

Assignor

AHADIAN, JOSEPH

Executed: 2002-08-13

Assignee

INTEL CORPORATION

2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054

Covered Property (1)

Flip-Chip Package Integrating Optical and Electrical Devices and Coupling to a Waveguide on a Board

Patent: 6,754,407 →

Application: 10/158,250 →

Publication: US 2003/0002770

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.