Patent Assignment
Reel/Frame 013296/0306
Assignment of Assignor's Interest
Recorded: 2002-09-12
Pages: 2
Assignee
MITSUBISHI DENKI KABUSHIKI KAISHA
2-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO 100-8310, JAPAN
Covered Property
(1)
Method of Manufacturing Semiconductor Device Having Tie Bars for Interconnecting Leads
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.