Patent Assignment
Reel/Frame 013356/0024
Assignment of Assignor's Interest
Recorded: 2002-10-02
Pages: 3
Assignors
YONEDA, YOSHIYUKI
Executed: 2002-08-23
MINAMIZAWA, MASAHARU
Executed: 2002-08-29
WATANABE, EIJI
Executed: 2002-08-27
SATO, MITSUTAKA
Executed: 2002-08-27
Assignee
FUJITSU LIMITED
1-1, KAMIKODANAKA 4-CHOME, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA 211-8588, JAPAN
Covered Property
(1)
Semiconductor Device Substrate and Manufacturing Method Thereof and Semiconductor Package
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 9, 2008
From: FUJITSU LIMITED
To: FUJITSU MICROELECTRONICS LIMITED
Reel/Frame 021976/0089 →
Change of Name
Jul 9, 2010
From: FUJITSU MICROELECTRONICS LIMITED
To: FUJITSU SEMICONDUCTOR LIMITED
Reel/Frame 024651/0744 →
Assignment of Assignor's Interest
Apr 27, 2015
From: FUJITSU SEMICONDUCTOR LIMITED
To: SOCIONEXT INC.
Reel/Frame 035508/0337 →