Patent Assignment
Reel/Frame 013370/0190
Assignment of Assignor's Interest
Recorded: 2002-10-04
Pages: 2
Assignors
ISHIKAWA, KENSUKE
Executed: 2002-08-08
SAITO, TATSUYUKI
Executed: 2002-08-09
MIYAUCHI, MASANORI
Executed: 2002-08-09
SAITO, TOSHIO
Executed: 2002-08-09
ASHIHARA, HIROSHI
Executed: 2002-08-09
Assignee
HITACHI, LTD.
6, KANDA SURUGADAI 4-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor Integrated Circuit Device with a Connective Portion for Multilevel Interconnection
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 26, 2003
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORPORATION
Reel/Frame 014569/0585 →
Merger
Jul 30, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025204/0512 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →