Semiconductor integrated circuit device with a connective portion for multilevel interconnection
View Patent ↗In manufacturing a semiconductor integrated circuit device, an interconnect trench and a contact hole are formed in an interlayer insulating film formed over a first-level interconnect on a semiconductor substrate, a barrier film is formed inside of the trench and contact hole so that its film thickness increases from the center of the bottom of the hole toward the sidewalls all around the bottom of the contact hole, a copper film is formed over the barrier film, and a second-level interconnect and a connector portion (plug) are formed by polishing by CMP. In this way, the geometrically shortest pathway of an electrical current flowing from the second-level interconnect toward the first-level interconnect through a connector portion (plug) does not coincide with a thin barrier film portion which has the lowest electrical resistance, so that the current pathway can be dispersed and a concentration of electrons does not occur readily.
1. A semiconductor integrated circuit device, comprising:
a first interconnect formed over a semiconductor substrate;
an insulating film formed over a semiconductor substrate and on said first interconnect;
a hole formed in said insulating film and having a bottom from which the surface of said first interconnect is partly exposed;
a first conductive film formed on the bottom and sidewall of said hole and being in contact with said first interconnect; and
a second conductive film formed on said first conductive film and embedded inside of said hole,
wherein said first conductive film includes a perpendicular portion arranged along the sidewall of said hole, a corner portion arranged near the corner of said hole and a level portion arranged along the bottom of said hole,
wherein the thickness of said level portion of said first conductive film is gradually increasing from the center of said hole toward outside, and
wherein the resistance of said first interconnect and the resistance of said second conductive film are lower than the resistance of said first conductive film.
2. A semiconductor integrated circuit device according to claim 1 ,
wherein the thickness of said level portion of said first conductive film is gradually increasing from the center of said hole toward outside in all directions perpendicular to an extending direction of said hole.
3. A semiconductor integrated circuit device according to claim 1 ,
wherein the thickness of said level portion of said first conductive film is gradually increasing from the center of said hole toward outside at least in an extending direction of said first interconnect.
4. A semiconductor integrated circuit device according to claim 1 ,
wherein said first conductive film is a refractory metal film or a nitride thereof.
5. A semiconductor integrated circuit device according to claim 1 ,
wherein said first conductive film is made of tantalum (Ta), tantalum nitride (TaN), titanium (Ti), titanium nitride (TiN), tungsten (W), tungsten nitride (WN), titanium silicide nitride (TiSiN) or tungsten silicide nitride (WSiN), or an alloy thereof, or a laminate film thereof.
6. A semiconductor integrated circuit device according to claim 1 ,
wherein said second conductive film is a copper (Cu) film or an alloy thereof.
7. A semiconductor integrated circuit device according to claim 1 ,
wherein said first conductive film has at least the minimum film thickness permitting maintenance of barrier properties between said second conductive film and said insulating film.