IP Library › Assignment 013434/0373
Patent Assignment
Reel/Frame 013434/0373

Assignment of Assignor's Interest

Recorded: 2002-10-24 Pages: 3
Assignors
LEE, JIN-YUAN
Executed: 2002-09-26
LIN, ERIC
Executed: 2002-09-26
Assignee
MEGIC CORPORATION
21 R&D FIRST ROAD, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, R.O.C., TAIWAN
Covered Property (1)
Thermal Compliant Semiconductor Chip Wiring Structure for Chip Scale Packaging
Patent: 6,806,570 →
Application: 10/279,267 →
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 4, 2006
From: MEGIC CORPORATION
To: MEGICA CORPORATION
Reel/Frame 017564/0653 →
Merger Sep 25, 2013
From: MEGICA CORPORATION
To: MEGIT ACQUISITION CORP.
Reel/Frame 031283/0198 →
Assignment of Assignor's Interest Jul 11, 2014
From: MEGIT ACQUISITION CORP.
To: QUALCOMM INCORPORATED
Reel/Frame 033303/0124 →