IP Library Assignment 013445/0873
Patent Assignment
Reel/Frame 013445/0873

Assignment of Assignor's Interest

Recorded: 2002-10-28 Pages: 2
Assignors
DU-NOUR, OFER
Executed: 2002-10-23
RUBINSTEIN, VLADIMIR
Executed: 2002-10-23
Assignee
TEVET PROCESS CONTROL TECHNOLOGIES LTD.
AGRA STREET, P.O. BOX 245, MOSHAVA YOKNEAM, 20600, ISRAEL
Covered Property (1)
Method and Apparatus for Thickness Decomposition of Complicated Layer Structures
Patent: 6,885,467 →
Application: 10/281,207 →
Publication: US 2004/0080761
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 7, 2008
From: TEVET PROCESS CONTROL TECHNOLOGIES, LTD.
To: NANOMETRICS INCORPORATED
Reel/Frame 021194/0642 →
Change of Name Apr 30, 2020
From: NANOMETRICS INCORPORATED
To: ONTO INNOVATION INC.
Reel/Frame 052544/0224 →