Patent Assignment
Reel/Frame 013499/0228
Assignment of Assignor's Interest
Recorded: 2002-11-12
Pages: 3
Assignee
SAMSUNG ELECTRONICS CO., LTD.
SAN 16, BANWOI, RI, TAEAN-EUB, HWASUNG-CITY, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Chip Package with Direction-Flexible Mountability
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.