Patent Assignment
Reel/Frame 013502/0682
Assignment of Assignor's Interest
Recorded: 2002-11-14
Pages: 3
Assignor
CHIEN, RAY
Executed: 2002-08-09
Assignee
VIA TECHNOLOGIES, INC.
8F, NO. 533, CHUNG-CHENG RD., HSIN-TIEN, TAIPEI, R.O.C., TAIWAN
Covered Property
(1)
Elastomer Interposer for Grid Array Packages and Method of Manufacturing the Same