Elastomer interposer for grid array packages and method of manufacturing the same
An elastomer interposer employed between a package and a printed circuit board and the method of manufacturing the same are disclosed. The elastomer interposer includes an elastomer, a plurality of conductive wires, Cu pads, solder resistant blocks and Ni/Au plated pads. The elastomer has two contact surfaces. The conductive wires are arranged inside the elastomer at a certain interval and tilted toward one of the contact surfaces with an inclined angle. The Cu pads are formed on both of the surfaces at a space, and electrically connected to the corresponding conductive wires. Also, the Ni/Au plated pads are formed over the Cu pads.
1. An elastomer interposer, employed between a package and a printed circuit board, comprising:
an elastomer, having a first surface and a second surface;
a plurality of conductive wires, arranged inside the elastomer at a certain interval and tilted toward the second surface with an inclined angle;
a plurality of first Cu pads, formed on the first surface at a space and electrically connected to the corresponding conductive wires;
a plurality of second Cu pads, formed on the second surface at the space and electrically connected to the corresponding conductive wires;
a plurality of first solder resistant blocks, having openings surrounding the first Cu pads, are on the first surface;
a plurality of second solder resistant blocks, having openings surrounding the second Cu pads, are on the second surface;
a plurality of first Ni/Au plated pads, formed on outer surface of the first Cu pads; and
a plurality of second Ni/Au plated pads, formed on outer surface of the second Cu pads.
2. The elastomer interposer according to claim 1 further comprises a plurality of first conductive bumps attached to the first Ni/Au plated pads.
3. The elastomer interposer according to claim 2 , wherein the elastomer interposer is electrically connected to the PCB by contacting with the first conductive bumps.
4. The elastomer interposer according to claim 3 , wherein the package is a ball grid array (BGA) package, and electrically connected to the elastomer interposer by soldering a plurality of first solder balls onto the second Ni/Au plated pads.
5. The elastomer interposer according to claim 3 , wherein the package is a column grid array (CGA) package, and electrically connected to the elastomer interposer by soldering a plurality of first metal rods onto the second Ni/Au plated pads.
6. The elastomer interposer according to claim 2 , wherein the package is a first land grid array (LGA) package, and electrically connected to the elastomer interposer by contacting with the first conductive bumps.
7. The elastomer interposer according to claim 6 , wherein a plurality of third solder balls attached to the second Ni/Au plated pads are soldered to the PCB pads, so as to achieve the electrical connection between the elastomer interposer and PCB.
8. The elastomer interposer according to claim 2 further comprises a plurality of second conductive bumps attached to the second Ni/Au plated pads.
9. The elastomer interposer according to claim 8 , wherein the package is a second land grid array (LGA) package, and electrically connected to the elastomer interposer by contacting the first conductive bumps.
10. The elastomer interposer according to claim 8 , wherein the elastomer interposer is electrically connected to the PCB by contacting the second conductive bumps with the PCB pads.
11. The elastomer interposer according to claim 1 further comprises a plurality of fourth solder balls attached to the first Ni/Au plated pads.
12. The elastomer interposer according to claim 11 , wherein the elastomer interposer is electrically connected to PCB by soldering the fourth solder balls onto the PCB pads.
13. The elastomer interposer according to claim 12 , wherein the package is a ceramic ball grid array (CBGA) package, and electrically connected to the elastomer interposer by soldering a plurality of fifth solder balls onto the second Ni/Au plated pads.
14. The elastomer interposer according to claim 13 , wherein coefficient of thermal expansion (CTE) of the CBGA package is approximately 8 ppm/° C., and CTE of the PCB is approximately 18 ppm/° C.
15. The elastomer interposer according to claim 12 , wherein the package is a plastic ball grid array (PBGA) package, and electrically connected to the elastomer interposer by soldering a plurality of sixth solder balls onto the second Ni/Au plated pads.
16. The elastomer interposer according to claim 15 , wherein CTE of the PBGA package is approximately 18 ppm/° C., and CTE of the PCB is approximately 5˜10 ppm/° C.
17. The elastomer interposer according to claim 1 , wherein the material of the elastomer is selected from the group consisting of silicon rubber compound, polyurethane compound, polyethylene compound, synthetic rubber, polysiloxane resin compound, acrylic compound and polyolefins compound.