Patent Assignment
Reel/Frame 013519/0305
Assignment of Assignor's Interest
Recorded: 2002-11-25
Pages: 2
Assignee
UNITED TEST CENTER INC.
NO. 2, LI-HSIEN RD. 3, SCIENCE BASED INDUSTRIAL PARK, HSIN CHU, R.O.C., TAIWAN
Covered Property
(1)
Bonding Pads of Printed Circuit Board Capable of Holding Solder Balls Securely
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Apr 21, 2005
From: UNITED TEST CENTER INC.
To: ULTRATERA CORPORATION
Reel/Frame 015928/0108 →
Change of Name
Dec 19, 2017
From: ULTRATERA CORPORATION
To: UTAC (TAIWAN) CORPORATION
Reel/Frame 044442/0224 →
Assignment of Assignor's Interest
Dec 22, 2017
From: UTAC (TAIWAN) CORPORATION
To: UTAC HEADQUARTERS PTE. LTD.
Reel/Frame 044467/0697 →
Assignment of Assignor's Interest
Aug 3, 2020
From: UTAC HEADQUARTERS PTE. LTD.
To: UTAC TAIWAN HOLDINGS
Reel/Frame 053377/0933 →
Assignment of Assignor's Interest
Jun 7, 2021
From: UTAC TAIWAN HOLDINGS
To: UTAC (TAIWAN) CORPORATION
Reel/Frame 056452/0177 →
Change of Name
Nov 15, 2021
From: UTAC (TAIWAN) CORPORATION
To: SIGURD UTC CORPORATION
Reel/Frame 058113/0940 →