Patent Assignment
Reel/Frame 013548/0795
Assignment of Assignor's Interest
Recorded: 2002-08-27
Pages: 3
Assignors
WATANABE, SHINJI
Executed: 2002-08-09
SAKAI, HIROSHI
Executed: 2002-08-09
SUZUKI, MOTOJI
Executed: 2002-08-09
IGARASHI, MAKOTO
Executed: 2002-08-09
TANAKA, AKIHIRO
Executed: 2002-08-09
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, 108-8001, JAPAN
Covered Property
(1)
Method of Manufacturing Mount Structure Without Introducing Degraded Bonding Strength of Electronic Parts Due to Segregation of Low-Strength/Low-Melting Point Alloy
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.