Patent Assignment
Reel/Frame 013575/0976
Assignment of Assignor's Interest
Recorded: 2002-12-05
Pages: 2
Assignor
DONO, CHIAKI
Executed: 2002-11-19
Assignee
ELPIDA MEMORY, INC.
2-1, YAESU 2-CHOME, CHUO-KU, TOKYO, JAPAN
Covered Property
(1)
Method of Verifying a Semiconductor Integrated Circuit Apparatus, Which Can Sufficiently Evaluate a Reliability of a Non-Destructive Fuse Module After It Is Assembled
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement
May 15, 2012
From: ELPIDA MEMORY, INC.
To: APPLE INC.
Reel/Frame 028209/0477 →
Security Agreement
Jul 29, 2013
From: PS4 LUXCO S.A.R.L.
To: ELPIDA MEMORY INC.
Reel/Frame 032414/0261 →
Release of Security Interest
Feb 24, 2014
From: APPLE, INC
To: ELPIDA MEMORY, INC.
Reel/Frame 032331/0637 →
Assignment of Assignor's Interest
May 15, 2014
From: ELPIDA MEMORY, INC.
To: PS4 LUXCO S.A.R.L.
Reel/Frame 032899/0588 →