Patent Assignment
Reel/Frame 013587/0517
Assignment of Assignor's Interest
Recorded: 2002-12-18
Pages: 3
Assignee
SEIKO INSTRUMENTS INC.
8, NAKASE-CHOME, MIHAMA-KU, CHIBA-SHI, CHIBA, JAPAN
Covered Property
(1)
Electronic Circuit Device Having Adhesion-Reinforcing Pattern on a Circuit Board for Flip-Chip Mounting an Ic Chip
Patent:
6,528,889 →
Application:
09/342,424 →
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.