Patent Assignment
Reel/Frame 013607/0539
Assignment of Assignor's Interest
Recorded: 2002-12-19
Pages: 2
Assignor
INTEGRATED ELECTRONICS & PACKING TECHNOLOGIES, INC
Executed: 2002-10-11
Assignee
CASIO COMPUTER CO., LTD.
6-2, HON-MACHI 1-CHOME, SHIBUYA-KU, TOKYO, JAPAN
Covered Property
(1)
Apparatus for Making Semiconductor Device
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 11, 2002
From: TANAKA, YASUO; MATSUMOTO, JIRO
To: OKI ELECTRIC INDUSTRY CO., LTD.; INTEGRATED ELECTRONICS & PACKAGING TECHNOLOGIES, INC.
Reel/Frame 012686/0884 →
Change of Name
Dec 11, 2008
From: OKI ELECTRIC INDUSTRY CO., LTD.
To: OKI SEMICONDUCTOR CO., LTD.
Reel/Frame 022052/0540 →
Change of Name
Dec 8, 2011
From: OKI SEMICONDUCTOR CO., LTD.
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 027352/0186 →
Assignment of Assignor's Interest
Dec 16, 2011
From: CASIO COMPUTER CO., LTD.
To: TERAMIKROS, INC.
Reel/Frame 027399/0570 →
Change of Address
Mar 21, 2014
From: LAPIS SEMICONDUCTOR CO., LTD.,
To: LAPIS SEMICONDUCTOR CO., LTD.
Reel/Frame 032495/0049 →