IP Library Assignment 013617/0343
Patent Assignment
Reel/Frame 013617/0343

Assignment of Assignor's Interest

Recorded: 2002-12-23 Pages: 3
Assignor
BAE, SE YEUL
Executed: 2002-12-02
Assignee
DONGBU ELECTRONICS CO., LTD.
891-10 DAECHI-DONG, KANGNAM-GU, SEOUL, KOREA, REPUBLIC OF
Covered Property (1)
Method for Forming Fuse in Semiconductor Device
Patent: 6,897,136 →
Application: 10/329,097 →
Publication: US 2003/0119293
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Apr 14, 2005
From: DONGBU ELECTRONICS CO., LTD.
To: DONGBUANAM SEMICONDUCTOR INC.
Reel/Frame 016069/0777 →