Patent Assignment
Reel/Frame 013666/0575
Assignment of Assignor's Interest
Recorded: 2003-01-15
Pages: 2
Assignors
MICHII, KAZUNARI
Executed: 2002-12-06
SHINONAGA, NAOYUKI
Executed: 2002-12-06
SEMBA, SHINJI
Executed: 2002-12-09
Assignee
MITSUBISHI DENKI KABUSHIKI KAISHA
2-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO 100-8310, JAPAN
Covered Property
(1)
.Lead Frame, and Method for Manufacturing Semiconductor Device and Method for Inspecting Electrical Properties of Small Device Using the Lead Frame
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Sep 10, 2003
From: MITSUBISHI DENKI KABUSHIKI KAISHA
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 014502/0289 →
Assignment of Assignor's Interest
Apr 7, 2004
From: MITSUBISHI DENKI KABUSHIKI KAISHA
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 015185/0122 →
Change of Name
Sep 13, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024973/0598 →